JPH0438140B2 - - Google Patents
Info
- Publication number
- JPH0438140B2 JPH0438140B2 JP59011225A JP1122584A JPH0438140B2 JP H0438140 B2 JPH0438140 B2 JP H0438140B2 JP 59011225 A JP59011225 A JP 59011225A JP 1122584 A JP1122584 A JP 1122584A JP H0438140 B2 JPH0438140 B2 JP H0438140B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon layer
- polycrystalline silicon
- layer
- mis
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59011225A JPS60154548A (ja) | 1984-01-24 | 1984-01-24 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59011225A JPS60154548A (ja) | 1984-01-24 | 1984-01-24 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60154548A JPS60154548A (ja) | 1985-08-14 |
JPH0438140B2 true JPH0438140B2 (en]) | 1992-06-23 |
Family
ID=11772011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59011225A Granted JPS60154548A (ja) | 1984-01-24 | 1984-01-24 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60154548A (en]) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2605286B2 (ja) * | 1987-06-29 | 1997-04-30 | ソニー株式会社 | 半導体装置の製造方法 |
JP3017860B2 (ja) * | 1991-10-01 | 2000-03-13 | 株式会社東芝 | 半導体基体およびその製造方法とその半導体基体を用いた半導体装置 |
JP4611621B2 (ja) * | 2003-06-20 | 2011-01-12 | 株式会社 日立ディスプレイズ | 薄膜半導体装置とその製造方法 |
US20050116290A1 (en) * | 2003-12-02 | 2005-06-02 | De Souza Joel P. | Planar substrate with selected semiconductor crystal orientations formed by localized amorphization and recrystallization of stacked template layers |
US7235433B2 (en) * | 2004-11-01 | 2007-06-26 | Advanced Micro Devices, Inc. | Silicon-on-insulator semiconductor device with silicon layers having different crystal orientations and method of forming the silicon-on-insulator semiconductor device |
US7285473B2 (en) * | 2005-01-07 | 2007-10-23 | International Business Machines Corporation | Method for fabricating low-defect-density changed orientation Si |
US7291539B2 (en) | 2005-06-01 | 2007-11-06 | International Business Machines Corporation | Amorphization/templated recrystallization method for hybrid orientation substrates |
-
1984
- 1984-01-24 JP JP59011225A patent/JPS60154548A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60154548A (ja) | 1985-08-14 |
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